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A THERMAL MODEL FOR IGBT MODULES AND ITS IMPLEMENTATION IN A REAL TIME SIMULATOR

机译:IGBT模块的热模型及其在实时仿真器中的实现

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摘要

As the power density and switching frequency increase, thermal analysis of power electronics system becomes imperative. The analysis provides valuable information on the semiconductor rating, long-term reliability and efficient heat-sink design. The aim of this thesis is to build a comprehensive thermal model for the power IGBT modules used in three-phase inverters in order to predict the dynamic junction temperature rise under real operating conditions. The thermal model is developed in two steps: first, the losses are calculated and then the junction temperature is estimated. The real-time simulation environment dictates the requirements for the models: easy implementation on the software platform SIMULINK and fast calculation time. The power losses model, which is based on the look-up table method for calculating the conduction and switching losses, are successfully built and implemented in the real time simulation environment. The power losses equations are derived from the experimental data. Several algorithms are developed to catch every switching event and to solve the synchronization problem in a real-time system. An equivalent RC network model is built to perform the thermal analysis. The parameters of the thermal network are extracted from the junction to case and case to ambient dynamic thermal impedance curves. Two separate approaches are followed in deriving these thermal characteristic curves. The first approach uses the experimental data available while the second approach uses the commercial software package ANSYS. The 3-D simulation results using ANSYS agree well with the experimental data and therefore can be relied upon to extract the parameters of the thermal RC network. The latter is successfully implemented using the transfer function method, and is then built in SIMULINK environment for the use in a real time simulator. The power losses and thermal RC network models are extensively tested in a real time simulator environment. The accuracy of the models is confirmed by comparing their predictions with the experimental data.
机译:随着功率密度和开关频率的增加,电力电子系统的热分析势在必行。该分析提供了有关半导体额定值,长期可靠性和高效散热设计的有价值的信息。本文的目的是为三相逆变器中使用的功率IGBT模块建立一个综合的热模型,以便预测实际工作条件下的动态结温升高。通过两个步骤建立热模型:首先,计算损耗,然后估算结温。实时仿真环境指示了模型的要求:在软件平台SIMULINK上易于实现且计算时间短。在实时仿真环境中成功建立并实现了基于查找表方法来计算导通和开关损耗的功率损耗模型。功率损耗方程式是从实验数据得出的。开发了几种算法来捕获每个切换事件并解决实时系统中的同步问题。建立等效的RC网络模型以执行热分析。从结点到外壳以及外壳到环境的动态热阻曲线提取热网络的参数。遵循两种单独的方法来得出这些热特性曲线。第一种方法使用可用的实验数据,而第二种方法使用商业软件包ANSYS。使用ANSYS进行的3-D仿真结果与实验数据非常吻合,因此可以依靠它来提取热RC网络的参数。后者使用传递函数方法成功实现,然后在SIMULINK环境中构建以供实时模拟器使用。功耗和热RC网络模型已在实时模拟器环境中进行了广泛测试。通过将模型的预测结果与实验数据进行比较,可以确定模型的准确性。

著录项

  • 作者

    Luo Zhaohui;

  • 作者单位
  • 年度 2002
  • 总页数
  • 原文格式 PDF
  • 正文语种 en
  • 中图分类

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