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P-Channel MOSFETs on 4H-SiC {0001} and Nonbasal Faces Fabricated by Oxide Deposition and N2O Annealing

机译:通过氧化沉积和N2O退火制造的4H-SiC {0001}和非基面上的P沟道MOSFET

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摘要

In this paper, we have investigated 4H-SiC p-channel metal-oxide-semiconductor field-effect transistors (MOSFETs) with deposited SiO2 followed by N2O annealing. In addition to deposited oxides, dry-O2-grown oxides and N2O-grown oxides were also adopted as the gate oxides of SiC p-channel MOSFETs. The MOSFETs have been fabricated on the 4H-SiC (0001), (0001macr), (033macr8), and (112macr0) faces. The (0001) MOSFETs with deposited oxides exhibited a relatively high channel mobility of 10 cm2/V ldr s, although a mobility of 7 cm2/V ldr s was obtained in the (0001) MOSFETs with N2O-grown oxides. The channel mobility was also increased by utilizing the deposited SiO2 in the MOSFETs fabricated on nonbasal faces, although the MOSFETs on (0001macr) were not operational. Compared with the thermally grown oxides, the deposited oxides annealed in N2O are effective in improving the performance of 4H-SiC p-channel MOSFETs.
机译:在本文中,我们研究了沉积有SiO2然后进行N2O退火的4H-SiC p沟道金属氧化物半导体场效应晶体管(MOSFET)。除沉积的氧化物外,干式O2生长的氧化物和N2O生长的氧化物也被用作SiC p沟道MOSFET的栅极氧化物。 MOSFET已在4H-SiC(0001),(0001macr),(033macr8)和(112macr0)面上制造。尽管在具有N2O生长氧化物的(0001)MOSFET中获得了7 cm2 / V ldr s的迁移率,但是具有沉积氧化物的(0001)MOSFET的迁移率却相对较高,为10 cm2 / V ldr s。尽管在(0001macr)上的MOSFET不工作,但通过利用在非基面上制造的MOSFET中沉积的SiO2,也提高了沟道迁移率。与热生长的氧化物相比,在N2O中退火的沉积氧化物可有效改善4H-SiC p沟道MOSFET的性能。

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