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Reduction of the thermal conductivity of the thermoelectric material ScN by Nb alloying

机译:Nb合金化降低热电材料ScN的导热系数

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摘要

ScN-rich (Sc,Nb)N solid solution thin films have been studied, motivated by the promising thermoelectric properties of ScN-based materials. Cubic Sc1-xNbxN films for 0 amp;lt;= x amp;lt;= 0.25 were epitaxially grown by DC reactive magnetron sputtering on a c-plane sapphire substrate and oriented along the (111) orientation. The crystal structure, morphology, thermal conductivity, and thermoelectric and electrical properties were investigated. The ScN reference film exhibited a Seebeck coefficient of -45 mu V/K and a power factor of 6 x 10(-4) W/m K-2 at 750K. Estimated from room temperature Hall measurements, all samples exhibit a high carrier density of the order of 10(21) cm(-3). Inclusion of heavy transition metals into ScN enables the reduction in thermal conductivity by an increase in phonon scattering. The Nb inserted ScN thin films exhibited a thermal conductivity lower than the value of the ScN reference (10.5W m(-1) K-1) down to a minimum value of 2.2 Wm(-1) K-1. Insertion of Nb into ScN thus resulted in a reduction in thermal conductivity by a factor of similar to 5 due to the mass contrast in ScN, which increases the phonon scattering in the material. Published by AIP Publishing.
机译:富ScN的(Sc,Nb)N固溶体薄膜已得到研究,这是受ScN基材料的热电性能推动的。通过直流反应磁控溅射在c面蓝宝石衬底上外延生长0 amp≤xamp≤0.25的立方Sc1-xNbxN膜,并沿(111)取向。研究了晶体结构,形态,热导率以及热电和电性能。 ScN参考膜在750K时的塞贝克系数为-45μV / K,功率因数为6 x 10(-4)W / m K-2。根据室温霍尔测量估计,所有样品均表现出大约10(21)cm(-3)的高载流子密度。在ScN中包含重过渡金属可通过增加声子散射来降低热导率。插入Nb的ScN薄膜的热导率比ScN基准值(10.5W m(-1)K-1)低,最低为2.2 Wm(-1)K-1。因此,由于ScN的质量差异,将Nb插入ScN会导致热导率降低约5倍,这会增加材料中的声子散射。由AIP Publishing发布。

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