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Surface passivation of crystalline silicon by Cat-CVD amorphous and nanocrystalline thin silicon films

机译:通过Cat-CVD非晶和纳米晶薄膜对晶体硅进行表面钝化

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摘要

In this work, we study the electronic surface passivation of crystalline silicon with intrinsic thin silicon films deposited by Catalytic CVD. The contactless method used to determine the effective surface recombination velocity was the quasi-steady-state photoconductance technique. Hydrogenated amorphous and nanocrystalline silicon films were evaluated as passivating layers on n- and p-type float zone silicon wafers. The best results were obtained with amorphous silicon films, which allowed effective surface recombination velocities as low as 60 and 130 cms -1 on p- and n-type silicon, respectively. To our knowledge, these are the best results ever reported with intrinsic amorphous silicon films deposited by Catalytic CVD. The passivating properties of nanocrystalline silicon films strongly depended on the deposition conditions, especially on the filament temperature. Samples grown at lower filament temperatures (1600 °C) allowed effective surface recombination velocities of 450 and 600 cms -1 on n- and p-type silicon.
机译:在这项工作中,我们研究了通过催化CVD沉积的本征硅薄膜对晶体硅的电子表面钝化。用于确定有效表面复合速度的非接触方法是准稳态光电导技术。评价氢化非晶硅和纳米晶硅膜作为n型和p型浮区硅晶片上的钝化层。用非晶硅膜可获得最佳结果,非晶硅膜在p型和n型硅上的有效表面重组速度分别低至60和130 cms -1。据我们所知,这是有史以来用催化CVD沉积的本征非晶硅膜所获得的最佳结果。纳米晶硅膜的钝化性能强烈取决于沉积条件,尤其是灯丝温度。在较低的灯丝温度(1600°C)下生长的样品可以在n型和p型硅上实现450和600 cms -1的有效表面重组速度。

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