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Influence of pressure and radio frequency power on deposition rate and structural properties of hydrogenated amorphous silicon thin films prepared by plasma deposition

机译:压力和射频功率对等离子体沉积氢化非晶硅薄膜沉积速率和结构性能的影响

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摘要

The influence of radio frequency (rf) power and pressure on deposition rate and structural properties of hydrogenated amorphous silicon (a-Si:H) thin films, prepared by rf glow discharge decomposition of silane, have been studied by phase modulated ellipsometry and Fourier transform infrared spectroscopy. It has been found two pressure regions separated by a threshold value around 20 Pa where the deposition rate increases suddenly. This behavior is more marked as rf power rises and reflects the transition between two rf discharges regimes. The best quality films have been obtained at low pressure and at low rf power but with deposition rates below 0.2 nm/s. In the high pressure region, the enhancement of deposition rate as rf power increases first gives rise to a reduction of film density and an increase of content of hydrogen bonded in polyhydride form because of plasma polymerization reactions. Further rise of rf power leads to a decrease of polyhydride bonding and the material density remains unchanged, thus allowing the growth of a-Si:H films at deposition rates above 1 nm/s without any important detriment of material quality. This overcoming of deposition rate limitation has been ascribed to the beneficial effects of ion bombardment on the a-Si:H growing surface by enhancing the surface mobility of adsorbed reactive species and by eliminating hydrogen bonded in polyhydride configurations.
机译:研究了射频(rf)功率和压力对硅烷的rf辉光放电分解制备的氢化非晶硅(a-Si:H)薄膜的沉积速率和结构性能的影响。红外光谱。已经发现两个压力区域被一个大约20 Pa的阈值分隔开,其中沉积速率突然增加。随着射频功率的增加,这种现象更加明显,反映了两个射频放电状态之间的过渡。在低压和低射频功率下,但沉积速率低于0.2 nm / s时,已获得质量最好的薄膜。在高压区域,由于等离子体聚合反应,随着射频功率的增加,沉积速率的提高首先导致膜密度的降低和以氢化物形式键合的氢含量的增加。射频功率的进一步提高会导致聚氢键的减少,并且材料密度保持不变,从而允许以高于1 nm / s的沉积速率生长a-Si:H膜,而不会严重损害材料质量。沉积速率限制的这种克服归因于离子轰击对a-Si:H生长表面的有益影响,其方式是通过增强吸附的反应物种的表面迁移率并消除以多氢键构型键合的氢。

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