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Simplified fabrication of back surface electric field silicon cells and novel characteristics of such cells

机译:背面电场硅电池的简化制造及其新特性

摘要

An investigation of the characteristics and behavior of 10 ohm-cm silicon cells having abnormally high open-circuit voltages was made. The cells studied were made by a new, highly simplified, contact fabrication process which creates both a contact and a thin electric field region at the cell back surface without the need for phosphorus layer removal. These cells had open-circuit voltages of about 0.58 V and their performance as a function of thickness, temperature, and 1 MeV electron irradiation is detailed. The study showed that 10 ohm-cm back-surface-field cells can have the high initial efficiencies and desirable temperature behavior of low resistivity cells. Thin back-surface-field cells were made and showed, in addition, much greater radiation damage resistance. A mechanism is proposed to explain the results.
机译:对具有异常高的开路电压的10 ohm-cm硅电池的特性和行为进行了研究。所研究的电池是通过一种新的,高度简化的触点制造工艺制成的,该工艺可在电池背面形成触点和薄电场区域,而无需去除磷层。这些电池的开路电压约为0.58 V,并详细说明了其性能随厚度,温度和1 MeV电子辐射的变化。研究表明,10 ohm-cm的背面场电池可以具有高的初始效率和低电阻率电池的理想温度行为。制成了薄的背面场电池,并显示出更大的抗辐射损伤性。提出了一种机制来解释结果。

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