Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures

摘要

The thermal conductance of oxygen-free high conductivity (OFHC) copper sample pairs with surface finishes ranging from 0.1 to 1.6-micrometers rms roughness was investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.