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Adhesion of Silicone Elastomer Seals for NASA's Crew Exploration Vehicle

机译:美国宇航局乘员探索车用有机硅弹性体密封件的粘合力

摘要

Silicone rubber seals are being considered for a number of interfaces on NASA's Crew Exploration Vehicle (CEV). Some of these joints include the docking system, hatches, and heat shield-to-back shell interface. A large diameter molded silicone seal is being developed for the Low Impact Docking System (LIDS) that forms an effective seal between the CEV and International Space Station (ISS) and other future Constellation Program spacecraft. Seals between the heat shield and back shell prevent high temperature reentry gases from leaking into the interface. Silicone rubber seals being considered for these locations have inherent adhesive tendencies that would result in excessive forces required to separate the joints if left unchecked. This paper summarizes adhesion assessments for both as-received and adhesion-mitigated seals for the docking system and the heat shield interface location. Three silicone elastomers were examined: Parker Hannifin S0899-50 and S0383-70 compounds, and Esterline ELA-SA-401 compound. For the docking system application various levels of exposure to atomic oxygen (AO) were evaluated. Moderate AO treatments did not lower the adhesive properties of S0899-50 sufficiently. However, AO pretreatments of approximately 10(exp 20) atoms/sq cm did lower the adhesion of S0383-70 and ELA-SA-401 to acceptable levels. For the heat shield-to-back shell interface application, a fabric covering was also considered. Molding Nomex fabric into the heat shield pressure seal appreciably reduced seal adhesion for the heat shield-to-back shell interface application.
机译:美国宇航局乘员探索车(CEV)的许多接口都考虑使用硅橡胶密封件。这些接头中的一些接头包括对接系统,舱口以及隔热板与后壳的接口。正在为低冲击对接系统(LIDS)开发大直径的模制硅树脂密封件,该密封件在CEV与国际空间站(ISS)和其他未来的星座计划航天器之间形成有效的密封。隔热罩和后壳之间的密封可防止高温折返气体泄漏到接口中。考虑到这些位置的硅橡胶密封件具有固有的粘合趋势,如果不加以检查,将导致分离接头所需的力过大。本文总结了对接系统和隔热屏接口位置的密封状态和已接收状态的密封件的粘合性评估。检查了三种有机硅弹性体:Parker Hannifin S0899-50和S0383-70化合物,以及Esterline ELA-SA-401化合物。对于对接系统应用,评估了各种程度的原子氧(AO)暴露水平。适度的AO处理不能充分降低S0899-50的粘合性能。但是,AO预处理约为10(exp 20)个原子/平方厘米,确实将S0383-70和ELA-SA-401的粘附力降低到可接受的水平。对于隔热板到后壳的接口应用,还考虑了织物覆盖物。将Nomex织物模制到隔热板压力密封件中,可显着降低密封件在隔热板与后壳之间的界面应用中的粘合力。

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