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High Power Semiconductor Devices and Solid State Switches for Pulsed Discharge Applications

机译:大功率半导体器件和固态开关,用于脉冲放电应用

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摘要

Based on long term experience, collected mainly with military applications like Rail Guns and Active Armour, a range of optimized semiconductor devices for pulsed applications was developed by ABB Switzerland Ltd and described in this presentation. The presented devices are optimized for pulsed discharge and fit very well for switching the short but high electrical power demand used for magnetic forming. Devices are available in different versions with silicon wafer diameters up to 120 mm and blocking voltages of over 6500V. Because of the different application requirements a differentiation is made in device technology. Depending on the discharge circuit, devices for low, medium, or high di/dt can be selected and the difference in advantages and disadvantages between both technologies will be described. To minimize the inductance between switching device and freewheeling diode, ABB can integrate this diode monolithic on the switching wafer. These so called reverse conducting devices are very common for magnetic forming applications. Thyristor structures are commercially available up to 8500V with 120 mm silicon wafers and GTO-like structures are available up to 4500V with 91 mm silicon wafers. For higher voltages or higher currents a combination of devices in series and/or parallel connection is required. The presentation will also describe the evolution of complete discharge switching modules in the range of 10kV / 50 kJ, a large discharge system of 21kV / 200kA, and a newly designed high current switch in the range of 15kV / 3MJ. The solid state switch solutions offered today and those shown in the presentation are based on a standard platform of components existing already for several years. For reliability reasons it is of great importance that the switch assemblies for high current pulsed applications are designed in cooperation with the device manufacturer who has in-depth knowledge of the switching behavior of the semiconductor components under pulsed conditions. The advantage of a complete switch assembly is that the whole unit can be tested under application conditions. ABB has a test capability up to 65 kV and 85 kJ stored energy.
机译:基于长期的经验(主要是在诸如轨道炮和Active Armour等军事应用中收集),ABB Switzerland Ltd开发了一系列用于脉冲应用的优化半导体器件,并在本演示中进行了介绍。提出的设备针对脉冲放电进行了优化,非常适合用于切换用于电磁成型的短而高的电力需求。器件有不同版本,硅晶片直径最大为120 mm,阻断电压超过6500V。由于不同的应用要求,因此在设备技术上有所不同。取决于放电电路,可以选择低,中或高di / dt的器件,并且将描述两种技术之间的优缺点的差异。为了使开关器件和续流二极管之间的电感最小,ABB可以将该二极管单片集成在开关晶片上。这些所谓的反向导通装置在磁性成型应用中非常普遍。晶闸管结构可通过120 mm硅片在8500V的电压下购得,而GTO类结构在91 mm硅片可在4500V的电压下购得。对于更高的电压或更高的电流,需要组合使用串联和/或并联连接的设备。该演讲还将描述10kV / 50kJ范围内完整的放电开关模块,21kV / 200kA的大型放电系统以及15kV / 3MJ范围内新设计的大电流开关的发展。今天提供的固态开关解决方案和演示中显示的解决方案均基于已经存在多年的标准组件平台。出于可靠性的考虑,与设备制造商合作设计用于大电流脉冲应用的开关组件非常重要,该设备制造商对脉冲条件下半导体组件的开关行为具有深入的了解。完整的开关组件的优点是可以在应用条件下对整个单元进行测试。 ABB的测试能力高达65 kV,储能为85 kJ。

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  • 作者

    Fleischmann W.; Welleman A.;

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  • 年度 2006
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  • 原文格式 PDF
  • 正文语种 eng
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