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Threshold Voltage Modeling of Recessed Source/Drain Soi Mosfet with Vertical Gaussian Doping Profile

机译:具有垂直高斯掺杂分布的隐式源/漏Sof Mosfet阈值电压建模

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摘要

Recessed-source/drain silicon-on-insulator (Re-S/D SOI) MOSFETs are being researched in both academia and industry because of its high drain current drive capability. In a Re-S/D SOI MOSFET, source and drain regions are stretched into the buried oxide (BOX) in order to reduce the series resistance. The electrical parameters are most important parts in defining the functionality of the device. First objective of the project work is to meet the electrical parameter specifications like threshold voltage, subthreshold swing, ON current and leakage current specified in ITRS 2011 and some other technical literature by adjusting of physical parameters like, silicon channel thickness, channel length and gate oxide thickness, that means it has to find out the physical parameters of the device for the standard values of electrical parameters. So, it has to maintain these device parameters for given specified values, the channel thickness, oxide thickness and gate length are adjusted accordingly. Fully depleted Re-S/D SOI MOSFETs possess good short channel immunity and close to ideal subthreshold characteristics. A number of attempts have been done to model the subthreshold characteristics of Re-S/D SOI MOSFETs with undoped or uniformly doped channel for getting more physical insight. However, the actual doping profile after the ion implantation step differs from uniform profile and resembles much with the Gaussian profile. In addition, the Gaussian profile in turn gives two more parameters, projected range (RP) and straggle (σp), which can control the device characteristics. In this project work, an effort has been done to develop a novel model for the threshold voltage of Re-S/D SOI MOSFETs with vertical Gaussian doping profile in the channel. The twodimensional Poisson’s and Maxwell equation has been solved in the channel region of the iii device considering the proper boundary conditions. The developed analytical model predicts the threshold voltage of the device for wide variations in the device parameters. MATLAB has been used for calculation of the analytical model results with variations in the device parameters. The model results are compared by the result obtained with ATLASTM device simulator to verify the accuracy of the model.
机译:源极/漏极绝缘体上硅(Re-S / D SOI)MOSFET由于其高漏极电流驱动能力而正在学术界和工业界进行研究。在Re-S / D SOI MOSFET中,源极和漏极区域被拉伸到掩埋氧化物(BOX)中,以减小串联电阻。电气参数是定义设备功能的最重要部分。该项目工作的首要目标是通过调整物理参数(例如硅沟道厚度,沟道长度和栅氧化层)来满足电气参数规范,例如阈值电压,亚阈值摆幅,导通电流和泄漏电流,这是ITRS 2011和其他一些技术文献中指定的厚度,这意味着它必须找出电气参数标准值的设备物理参数。因此,必须为给定的指定值保持这些器件参数,相应地调整沟道厚度,氧化物厚度和栅极长度。完全耗尽的Re-S / D SOI MOSFET具有良好的短通道抗扰度,接近理想的亚阈值特性。已经进行了许多尝试来模拟具有未掺杂或均匀掺杂沟道的Re-S / D SOI MOSFET的亚阈值特性,以获取更多的物理信息。但是,离子注入步骤之后的实际掺杂分布不同于均匀分布,并且与高斯分布非常相似。此外,高斯分布又提供了两个参数,即投影范围(RP)和散布(σp),它们可以控制器件的特性。在该项目工作中,已努力开发一种新颖的Re-S / D SOI MOSFET阈值电压模型,该模型在沟道中具有垂直高斯掺杂曲线。考虑到适当的边界条件,二维泊松和麦克斯韦方程已经在iii器件的沟道区域中求解。开发的分析模型可预测器件参数的阈值电压变化很大。随着设备参数的变化,MATLAB已用于计算分析模型结果。将模型结果与ATLASTM设备模拟器获得的结果进行比较,以验证模型的准确性。

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    Kushwaha Mukesh Kumar;

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  • 年度 2015
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