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Dynamic wetting and heat transfer at the initiation of aluminum solidification on copper substrates

机译:铝基板上铝固化开始时的动态润湿和传热

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摘要

Dynamic wetting and heat transfer during the start of solidification were studied with the help of molten aluminum droplets falling from a crucible onto a copper substrate. A high-speed camera captured the change in the spreading droplet\u2019s geometry, while thermocouples, inserted inside the substrate, allowed a heat transfer analysis to be performed. Droplet spreading factors and interfacial heat fluxes were then used to respectively characterize dynamic wetting and heat transfer for the various experimental conditions explored. These were: 1) effects of chemical composition of the aluminum alloy, 2) initial temperature of the substrate, 3) surface roughness of the substrate and 4) composition of the gaseous atmosphere. The experiments were all carried out in gaseous atmospheres containing oxygen in sufficient amount to form oxide skins at the surface of the droplets and the substrates. The results showed instances where an improvement in the dynamic wetting was accompanied by an increase in heat transfer during the early stages of solidification but this was not systematic. In these cases where a positive correlation was not observed, it was postulated this was caused by factors such as variations in the oxidation at the surface of the substrates and the droplets as well as gas trapped at the interface between the droplets and the substrates.
机译:在熔融开始时借助熔融铝滴从坩埚落到铜基材上的过程中研究了动态润湿和传热。高速相机捕获了散布液滴的几何形状的变化,而插入基板内部的热电偶允许进行传热分析。然后,在探索的各种实验条件下,使用液滴扩散因子和界面热通量分别表征动态润湿和传热。它们是:1)铝合金化学成分的影响,2)基材的初始温度,3)基材的表面粗糙度和4)气体气氛的成分。实验全部在含有足够量的氧气的气体气氛中进行,以在液滴和基底的表面上形成氧化皮。结果表明,在凝固的早期阶段,动态润湿的改善伴随着传热的增加,但是这种情况不是系统的。在这些未观察到正相关的情况下,推测这是由诸如基底表面和液滴表面的氧化变化以及在液滴与基底之间的界面处捕获的气体等因素引起的。

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