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Corrosion resistance properties of superhydrophobic copper surfaces fabricated by one-step electrochemical modification process

机译:一步电化学改性法制备的超疏水铜表面的耐腐蚀性能

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摘要

Superhydrophobic copper surfaces have been prepared by a one-step electrochemical modification process in an ethanolic stearic acid solution. In this work, the corrosion properties of hydrophobic copper surface and superhydrophobic copper surfaces were analyzed by means of electrochemical analyses and compared with that of as-received bare copper substrate. The decrease of corrosion current density (icorr) as well as the increase of polarization resistance (Rp) obtained from potentiodynamic polarization curves revealed that the superhydrophobic film on the copper surfaces improved the corrosion resistance performance of the copper substrate.
机译:通过在硬脂酸乙醇溶液中进行一步式电化学改性,可以制备超疏水性铜表面。在这项工作中,通过电化学分析对疏水性铜表面和超疏水性铜表面的腐蚀性能进行了分析,并与原样的裸铜基板进行了比较。由电位动力学极化曲线获得的腐蚀电流密度(icorr)的降低以及极化电阻(Rp)的增加表明,铜表面上的超疏水膜改善了铜基板的耐腐蚀性能。

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