首页> 外文OA文献 >Design and manufacturing of integrated optical devices in visible spectrum = Diseño y fabricación de dispositivos integrados de guías de onda en espectro visible
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Design and manufacturing of integrated optical devices in visible spectrum = Diseño y fabricación de dispositivos integrados de guías de onda en espectro visible

机译:可见光谱中的集成光学器件的设计和制造=可见光谱中的集成波导器件的设计和制造

摘要

In this project we aim at addressing the study of the full manufacturing process of a photonic integrated circuit, from the initial stage of components design to the tests required to ensure its proper functioning. Its most innovative aspect compared to the existing technology is that the wavelength used belongs to the visible light spectrum. Thus the dimensions of the waveguides have to be significantly reduced. For this reason, the analysis of new manufacturing protocols, using new materials and new techniques, is required. In addition, the current methods will be also modified in order to be optimized for our scenario.udIn a first step, design and simulation of the desired devices were conducted so that a set of different configurations can be approached. After that, theudintegration of the maximum number of these configurations was settled in audchromium mask design. This mask was then used in the photolithographyudprocess to harden SU-8 photoresist over a silicon substrate. Good fabricationudresults were obtained, being able to reach waveguides structures of 0.5 μm thick and 1.5 μm wide. The final chips were characterized in a dark room with two different laser input and proper light guidance was demonstrated as well as output switching.
机译:在这个项目中,我们致力于研究光子集成电路的整个制造过程,从组件设计的初始阶段到确保其正常运行所需的测试。与现有技术相比,它最创新的方面是所使用的波长属于可见光谱。因此,必须大大减小波导的尺寸。因此,需要使用新材料和新技术对新制造协议进行分析。此外,当前的方法也将进行修改,以便针对我们的情况进行优化。 ud第一步,对所需设备进行了设计和仿真,以便可以采用一组不同的配置。此后,将这些配置的最大数量的整合到一个 u u003b u003b u003c然后将该掩模用于光刻/ ud工艺中,以在硅衬底上硬化SU-8光刻胶。获得了良好的制造/结果,能够达到0.5μm厚和1.5μm宽的波导结构。最终的芯片在具有两个不同激光输入的暗室中进行了表征,并演示了正确的光导以及输出切换。

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