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Interfacial Phenomena in Al/Al, Al/Cu, and Cu/Cu Joints Soldered Using an Al-Zn Alloy with Ag or Cu Additions

机译：使用添加了Ag或Cu的Al-Zn合金焊接的Al / Al，Al / Cu和Cu / Cu接头中的界面现象

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Janusz Pstruś; Tomasz Gancarz;
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1. Interfacial Phenomena in Al/Al, Al/Cu, and Cu/Cu Joints Soldered Using an Al-Zn Alloy with Ag or Cu Additions [J] . Janusz Pstrus, Tomasz Gancarz Journal of Materials Engineering and Performance . 2014,第5期

机译：使用添加了Ag或Cu的Al-Zn合金焊接的Al / Al，Al / Cu和Cu / Cu接头中的界面现象
2. Effects of rapid solidification process and 0.1Pr/Nd addition on characteristics of Sn-9Zn solder alloy and interfacial properties of Cu/solder/Cu joints [J] . 赵国际, 光华, 盛光敏, 中南大学学报（英文版） . 2016,第008期

机译：快速凝固工艺和添加0.1％Pr / Nd对Sn-9Zn钎料合金性能和Cu /钎料/ Cu接头界面性能的影响
3. Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints [J] . Yee-Wen Yen, Weng-Ting Chou, Hong-Chih Chen, Zeitschrift fur Metallkunde . 2008,第11期

机译：微量添加铅对Sn-3.0Ag-0.5Cu / Cu和Sn-58Bi / Cu焊点的界面反应和力学性能的影响
4. The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints with Bi and Cr additions during thermal aging [C] . Ju Guokui, Bi Wenzhen, Lin Fei, International Conference on Electronic Packaging Technology and High Density Packaging . 2012

机译：热老化过程中三种添加Bi和Cr的Cu / SnAgCu / Cu焊点的界面IMC生长的比较研究。
5. Effects of Rare Earth Metal Additions on the Performance of Al-Cu and Al-Si-Cu Based Alloys =Effets de l'ajout des métaux terres rares sur les performances des alliages Al-Cu et Al-Si-Cu [D] . Mahmoud, Mohamed Gamal Ramadan. 2018

机译：稀土金属添加对Al-Cu和Al-Si-Cu基合金性能的影响=加入稀有金属对Al-Cu和Al-Si-Cu合金性能的影响
6. Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition [O] . Qingfeng Wang, Hong Chen, Fengjiang Wang 2019

机译：微量锌对时效条件下Sn-10Bi / Cu焊点界面演变的影响
7. Effect of Trace Zn Addition on Interfacial Evolution in Sn-10Bi/Cu Solder Joints during Aging Condition [O] . Qingfeng Wang, Hong Chen, Fengjiang Wang 2019

机译：痕量Zn添加对老化条件下Sn-10Bi / Cu焊点界面演化的影响
8. Calculation of Thermophysical Properties in Binary Copper-Rich Cu-Cr, Cu-Mg, Cu-Te, Cu-ti and Cu-Zr Alloys [R] . Miettinen, J. 2002

机译：二元富铜Cu-Cr，Cu-mg，Cu-Te，Cu-Ti和Cu-Zr合金的热物理性质计算

Interfacial Phenomena in Al/Al, Al/Cu, and Cu/Cu Joints Soldered Using an Al-Zn Alloy with Ag or Cu Additions

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