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Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

机译：无铅焊点的形貌和剪切强度陶瓷纳米颗粒增强的Sn3.0Ag0.5Cu锡膏

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A. Yakymovych; Yu. Plevachuk; P. Švec; D. Janičkovič; P. Šebo; N. Beronská; A. Roshanghias; H. Ipser;
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1. 纳米颗粒增强纳米流体对刀具磨损形貌的影响 [J] . Seyed Hasan MUSAVI, Behnam DAVOODI, Seyed Ali NIKNAM 中南大学学报（英文版） . 2019,第005期
2. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles [J] . Yakymovych A., Plevachuk Yu., Svec P. Sr., Journal of Electronic Materials . 2016,第12期

机译：陶瓷纳米粒子增强Sn3.0Ag0.5Cu锡膏的无铅焊点的形貌和剪切强度
3. Shear strengths of CBGA/PBGA solder ball joints with lead-free solder pastes [J] . Sung Yi International journal of materials and structural integrity . 2014,第1a2a3期

机译：含无铅焊膏的CBGA / PBGA焊球接头的剪切强度
4. TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process [J] . F. Che Ani, A. Jalar, R. Ismail, Journal of Advanced Manufacturing Technology . 2018,第1期

机译：TIO2纳米颗粒增强了无铅96.5Sn–3.0Ag–0.5Cu焊膏，用于回流焊接工艺中的超细封装组装
5. The effects of Cu nanoparticles addition in Sn-3.0Ag-0.5Cu solder paste on the microstructure and shear strength of the solder joints [C] . Ping Liu, Xiaolong Gu, Haifeng Fu, International Conference on Electronic Packaging Technology . 2016

机译：Sn-3.0Ag-0.5Cu锡膏中添加Cu纳米粒子对焊点组织和剪切强度的影响
6. A Study on Process, Strength and Microstructure Analysis of Low Temperature SnBi-Containing Solder Pastes Mixed with Lead-free Solder Balls [D] . Kannammal Palaniappan, Sakthi Cibi. 2016

机译：低温SNBI焊膏的工艺，强度和微观结构分析混合无铅焊球
7. Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength [O] . Anas M. Atieh, Tala J. Abedalaziz, Abdulaziz AlHazaa, 2019

机译：使用Sn纳米粒子增强焊膏焊接无源部件：对微观结构和关节强度的影响
8. Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles [O] . Yakymovych, A., Institut fur Anorganische Chemie - funktionelle Materialien, Fakultat fur Chemie, University of Vienna, Plevachuk, Yu., 2016

机译：陶瓷纳米粒子增强Sn3.0Ag0.5Cu锡膏的无铅焊点的形貌和剪切强度

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

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