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Modeling on phosphor sedimentation phenomenon during curing process of high power LED packaging

机译：大功率LED封装固化过程中荧光粉沉降现象的建模

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Yiman Wang; Huai Zheng; Run Hu; Xiaobing Luo;
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1. Study on phosphor sedimentation effect in white light-emitting diode packages by modeling multi-layer phosphors with the modifiedKubelka-Munk theory [J] . Run Hu, Yiman Wang, Yong Zou, Journal of Applied Physics . 2013,第6期

机译：用改进的Kubelka-Munk理论模拟多层荧光粉，研究白色发光二极管封装中的荧光粉沉降效果
2. Packaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration [J] . Yuan-Chang Lin, Jiun Pyng You, Nguyen T. Tran, Journal of Electronic Packaging . 2011,第1期

机译：基于荧光粉的高功率白光LED的包装：荧光粉浓度和包装配置的影响
3. Study on Convective Flow Behaviors of Phosphor Particles During Curing Process of Silicone and the Influences on the Optical Performance of White LEDs [J] . Ding Xinrui, Shao Changkun, Peng Ziming, IEEE Transactions on Electron Devices . 2021,第6期

机译：硅胶固化过程中磷光体颗粒对流流动的研究及对白光LED光学性能的影响
4. Phosphor particle spatial patterning for high angular color uniformity LED packaging through selective curing and settling [C] . Xinyao Lu, Weixiang Wang, Zhenpeng Su, International Conference on Electronic Packaging Technology . 2019

机译：通过选择性固化和沉降来实现高角度色彩均匀性LED封装的磷光体粒子空间图案化
5. Coupled electromagnetic thermal and kinetic modeling for microwave processing of polymers with temperature- and cure-dependent permittivity using 3D FEM. [D] . Sun, Rensheng. 2005

机译：使用3D FEM对具有温度和固化依赖介电常数的聚合物进行微波处理的电磁热力学和动力学耦合模型。
6. Color Shift Failure Prediction for Phosphor-Converted White LEDs by Modeling Features of Spectral Power Distribution with a Nonlinear Filter Approach [O] . Jiajie Fan, Moumouni Guero Mohamed, Cheng Qian, 2017

机译：通过使用非线性滤波方法建模光谱功率分布的特征来预测磷光转换的白光LED的色移失败
7. Improving CRI and Luminous Efficiency of Phosphor-Converted Full-Spectrum WLEDs by Powder Sedimentation Packaging [O] . -1

机译：通过粉末沉淀包装改善磷光体转换全光谱的CRI和发光效率
8. Coupled process modeling and waste package performance [R] . McGrail, B. P., Engel, D. W. 1992

机译：耦合过程建模和废物包性能

Modeling on phosphor sedimentation phenomenon during curing process of high power LED packaging

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