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Low damage etching of GaN surfaces via bias-assisted photoenhanced electrochemical oxidation in deionized water

机译:在去离子水中通过偏压辅助光增强电化学氧化对GaN表面进行低损伤蚀刻

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摘要

Properties of GaN surfaces etched by bias-assisted photoenhanced electrochemical (PEC) oxidation in deionized water and subsequent removal of the oxidized material are investigated using Schottky diodes fabricated on etched surfaces. It is demonstrated that with a short anneal at 700°C after removal of the oxide, it is possible to obtain a low damage surface with near ideal breakdown and capacitance-voltage (C-V) characteristics. Good quality Schottky diodes are fabricated on surfaces etched as much as 120 nm. The undercutting of masked surfaces is also demonstrated. Thus, given the band-gap selectivity, the possibility to undercut masked areas, and the low damage surfaces that can be obtained, the process demonstrated in this paper is suitable for use in fabrication of self-aligned GaN bipolar transistor structures. © Springer-Verlag 2007.
机译:使用在蚀刻表面上制造的肖特基二极管,研究了在去离子水中通过偏压辅助光增强电化学(PEC)氧化蚀刻的GaN表面的性能以及随后去除的氧化材料。结果表明,在去除氧化物后,在700°C进行短时间退火,可以获得具有接近理想击穿和电容-电压(C-V)特性的低损伤表面。高质量肖特基二极管是在被蚀刻至120 nm的表面上制造的。还演示了蒙版表面的底切。因此,考虑到带隙选择性,对掩膜区域进行底切的可能性以及可获得的低损伤表面,本文证明的工艺适用于制造自对准GaN双极晶体管结构。 ©Springer-Verlag 2007。

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