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Gate leakage current reduction with advancement of graded barrier AlGaN/GaN HEMT

机译:随着梯度势垒AlGaN / GaN HEMT的发展,降低栅极漏电流

摘要

The gate leakage current reduction solution of AlGaN/GaN HEMT device issue has been addressed in this paper with compositional grading of AlGaN barrier layer. This work is also conjugated with the critical thickness limitation of heterostructure material growth. Hence, critical thickness calculation of AlGaN over GaN has been kept in special view. 1D Schrodinger and Poisson solver was used to calculate the 2DEG concentration and effective location to use it in the ATLAS device simulator for the predictions. The proposed Al0.50Ga0.50N/Al0.35Ga0.65N /Al0.20Ga0.80N/GaN HEMT structure exhibits the leakage current of the order of around 15 nA/mm at gate voltage of 1 V.When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/27896
机译:本文通过AlGaN势垒层的成分分级解决了AlGaN / GaN HEMT器件的栅漏电流降低解决方案。这项工作还与异质结构材料生长的临界厚度限制相结合。因此,在特殊情况下,始终保持AlGaN在GaN之上的临界厚度计算。使用一维Schrodinger和Poisson求解器来计算2DEG浓度和有效位置,以将其用于ATLAS设备模拟器进行预测。拟议的Al0.50Ga0.50N / Al0.35Ga0.65N / Al0.20Ga0.80N / GaN HEMT结构在1 V的栅极电压下表现出大约15 nA / mm的泄漏电流。使用以下链接http://essuir.sumdu.edu.ua/handle/123456789/27896

著录项

  • 作者

    Das Palash; Biswas Dhrubes;

  • 作者单位
  • 年度 2011
  • 总页数
  • 原文格式 PDF
  • 正文语种 en
  • 中图分类

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