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Investigation of current-voltage characteristics of Ni/GaN Schottky barrier diodes for potential hemt applications

机译:Ni / GaN肖特基势垒二极管的电流电压特性研究

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摘要

In the present work, the I-V characteristics of Ni/GaN Schottky diodes have been studied. The Schottky diodes, having different sizes using Ni/Au and ohmic contacts using Ti/Al/Ni/Au were made on n-GaN. The GaN was epitaxially grown on c-planeudsapphire by metal organic chemical vapor deposition (MOCVD) technique and had a thickness of about 3.7 μm. The calculated ideality factor and barrier height from current-voltage (I-V) characteristics (at 300 K) for two GaN Schottky diodes wereudclose to ~1.3 and ~ 0.8 eV respectively. A high reverse leakage current in the order of 10 – 4A/cm2 (at – 1 V) was observed in both diodes. A careful analysis of forward bias I-V characteristics showed very high series resistance and calculation for ideality factor indicated presence of other current transport mechanism apart from thermionicudmodel at room temperature.When you are citing the document, use the following link http://essuir.sumdu.edu.ua/handle/123456789/22021
机译:在目前的工作中,已经研究了Ni / GaN肖特基二极管的I-V特性。在n-GaN上制作了使用Ni / Au具有不同尺寸和使用Ti / Al / Ni / Au形成欧姆接触的肖特基二极管。 GaN通过金属有机化学气相沉积(MOCVD)技术在c面 udsapphire上外延生长,并且具有约3.7μm的厚度。从两个GaN肖特基二极管的电流-电压(I-V)特性(在300 K下)计算出的理想因子和势垒高度分别接近于〜1.3 eV和〜0.8 eV。在两个二极管中均观察到大约10 – 4A / cm2(在– 1 V时)的反向泄漏电流很高。对正向偏置IV特性的仔细分析显示出非常高的串联电阻,并且对理想因子的计算表明在室温下除了热离子 udmodel之外还存在其他电流传输机制。当引用本文时,请使用以下链接http:// essuir .sumdu.edu.ua / handle / 123456789/22021

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