High Speed Real-time Temperature Monitoring System inside Power Devices Package Using Infrared Radiation

摘要

We proposed high speed real-time temperature monitoring system using infrared radiation in order to analyse thermal behaviour inside power device packag-es. This system was able to monitor thermal distribution in the package and confirmed thermal transition in this area with time resolution of 10 ms and special resolution of 15μm. Accuracy of the measured temperature of each material with different infrared emissivity in the pack-age was ensured by calibration obtained experimentally.