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Improvement of the performance of GaN-based LEDs grown on sapphire substrates patterned by wet and ICP etching

机译:改善通过湿法和ICP蚀刻在蓝宝石衬底上生长的GaN基LED的性能

摘要

Sapphire substrates patterned by a selective chemical wet and an inductively coupled plasma (ICP) etching technique was proposed to improve the performance of GaN-based light-emitting diodes (LEDs). GaN-based LEDs were fabricated on sapphire substrates through metal organic chemical vapor deposition (MOCVD). The LEDs fabricated on the patterned substrates exhibit improved device performance compared with the conventional LED fabricated on planar substrates when growth and device fabricating conditions were the same. The light output powers of the LEDs fabricated on wet-patterned and ICP-patterned substrates were about 37% and 17% higher than that of LEDs on planar substrates at an injection current of 20 mA, respectively. The enhancement is attributable to the combination of the improvement of GaN-based epilayers quality and the improvement of the light extraction efficiency. (c) 2008 Elsevier Ltd. All rights reserved.
机译:提出了通过选择性化学湿法和感应耦合等离子体(ICP)蚀刻技术对蓝宝石衬底进行图案化的方法,以提高GaN基发光二极管(LED)的性能。通过金属有机化学气相沉积(MOCVD)在蓝宝石衬底上制造基于GaN的LED。当生长和器件制造条件相同时,与在平面基板上制造的常规LED相比,在图案化基板上制造的LED表现出改善的器件性能。在20 mA的注入电流下,在湿式和ICP基板上制造的LED的光输出功率分别比在平面基板上的LED的光输出功率高约37%和17%。所述增强归因于基于GaN的外延层质量的改善和光提取效率的改善的结合。 (c)2008 Elsevier Ltd.保留所有权利。

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