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N-type ohmic contacts to undoped GaAs/AlGaAs quantum wells using only front-sided processing: Application to ambipolar FETs

机译:仅使用正面处理即可将N型欧姆接触用于未掺杂的GaAs / AlGaAs量子阱:应用于双极性FET

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摘要

We report the development of a simple and reliable, front-sided-only fabrication technique for n-type ohmic contacts to two-dimensional electron gases (2DEGs) in undoped GaAs/AlGaAs quantum wells. We have adapted the well-established recessed ohmic contacts/insulated metal gate technique for inducing a 2DEG in an undoped triangular well to also work reliably for undoped square quantum wells. Our adaptation involves a change in the procedure for etching the ohmic contact pits to optimise the etch side-wall profile and depth. As an application of our technique, we present a front-side-gated ambipolar field effect transistor (FET), where both 2D electron and hole gases can be induced in the same quantum well. We present results of low-temperature (0.3 K - 4 K) transport measurements of this device, including assessment of the n-type ohmic contact quality. On the basis of our findings, we discuss why the fabrication of these contacts is difficult and how our technique circumvents the challenges.
机译:我们报告了一种简单可靠的,仅正面制造技术的发展,该技术用于在未掺杂的GaAs / AlGaAs量子阱中对二维电子气(2DEG)进行n型欧姆接触。我们已经采用了完善的嵌入式欧姆接触/绝缘金属栅技术,以在未掺杂的三角形阱中诱发2DEG,从而也可以可靠地用于未掺杂的方形量子阱。我们的修改涉及改变刻蚀欧姆接触坑的程序,以优化刻蚀侧壁的轮廓和深度。作为我们技术的一种应用,我们提出了一种正面门控的双极场效应晶体管(FET),其中可以在同一量子阱中感应2D电子和空穴气体。我们介绍了该设备的低温(0.3 K-4 K)传输测量结果,包括对n型欧姆接触质量的评估。根据我们的发现,我们讨论了为什么制造这些触点很困难以及我们的技术如何规避挑战。

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