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A novel preparation technique for an aluminium-alumina MMC by a roll bonding process

机译：辊压工艺制备铝-氧化铝MMC的新技术

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Department of Industrial and Systems Engineering

机译：工业与系统工程系

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作者
Yuen H; Ralph B; Lee WB;
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年度 1993
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正文语种 eng
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1. ACOUSTIC EMISSION AND THE PORTEVIN - LE CHATELIER EFFECT IN TENSILE TESTED AI ALLOYS BEFORE AND AFTER PROCESSING BY ACCUMULATIVE ROLL-BONDING (ARB) TECHNIQUE [J] . A. PAWELEK, J. KUSNIERZ, Z. JASIENSKI Archives of Metallurgy and Materials . 2009,第1期

机译：累积轧制（ARB）技术处理之前和之后的拉伸测试AI合金中的声发射和PORTEVIN-LE CHATELIER效应
2. ACOUSTIC EMISSION AND THE PORTEVIN - LE CHATELIER EFFECT IN TENSILE TESTED AI ALLOYS BEFORE AND AFTER PROCESSING BY ACCUMULATIVE ROLL-BONDING (ARB) TECHNIQUE [J] . A. PAWELEK, J. KUSNIERZ, Z. JASIENSKI Archives of Metallurgy and Materials . 2009,第1期

机译：通过累积轧制（ARB）技术在加工前后拉伸测试AI合金的声发射和Portevin-Le Chatelier效应
3. Synthesis, Characterization and Mechanical Properties of AA7075 Based MMCs Reinforced with TiB2 Particles Processed Through Ultrasound Assisted In-Situ Casting Technique [J] . Meti Vinod Kumar V., Shirur Shridhar, Nampoothiri Jayakrishnan, Transactions of the Indian Institute of Metals . 2018,第4期

机译：通过超声辅助原位铸造技术处理AA7075基于AA7075的MMC的合成，表征和力学性能
4. Development of a low cost process for manufacturing of Ti-MMC by Roll-Diffusion-Bonding [C] . C.Testani, F. Ferraro International conference on processing manufacturing of advanced materials;THERMEC 2009 . 2009

机译：开发一种通过辊扩散结合技术制造Ti-MMC的低成本工艺
5. Analysis of a mechanical punching process to create registration holes on a continuous Roll-to-Roll flexible electronics substrates using SPC techniques. [D] . Yepez, Denisse E. 2008

机译：分析使用SPC技术在连续的卷对卷柔性电子基板上创建定位孔的机械冲压过程。
6. Annealing Effects in Twin-Roll Cast AA8006 Aluminium Sheets Processed by Accumulative Roll-Bonding [O] . Miroslav Cieslar, Michaela Poková 2014

机译：累积滚焊处理的双辊铸造AA8006铝板的退火效果
7. A novel preparation technique for an aluminium-alumina MMC by a roll bonding process [O] . Yuen H, Ralph B, Lee WB 1993

机译：辊压工艺制备铝-氧化铝MMC的新技术
8. Combined Experimental and Numerical Technique to Estimate Interfacial Bond Strength in MMC-Encapsulated Ceramic Systems. [R] . B. McWilliams C. Yen D. Gray R. Carter 2013

机译：结合实验和数值技术估算mmC封装陶瓷体系的界面结合强度。

A novel preparation technique for an aluminium-alumina MMC by a roll bonding process

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