Effect of crystallographic orientation in diamond turning of copper single crystals

摘要

The machinability of copper single crystals in terms of chip and surface roughness generation was studied under various diamond cutting conditions. The chip thickness and shear angle varies considerably with the changing crystallographic orientation of materials being cut. Anisotropy in surface finish occurs when the cutting direction relative to the crystal orientation varies successively as encountered in facing. There exists cyclic variation of surface roughness per workpiece revolution which is closely related to crystallographic orientation of the crystals being cut. Such anisotropy of surface roughness can be minimized with an appropriate selection of the feed rate.