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Study on the dielectric properties of hybrid and porous polyimide-silica films

机译：杂化和多孔聚酰亚胺-二氧化硅薄膜的介电性能研究

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Multi-functional Materials and Structures - International Conference on Multifunctional Materials and Structures, Hong Kong, P.R., 28-31 July 2008

机译：多功能材料和结构-多功能材料和结构国际会议，香港，中国，2008年7月28日至31日

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Zhang Y; Su Q; Yu L; Zheng H; Huang H; Zhang G; Yao Y; Chan HLW;
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年度 2008
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1. Moisture uptake and dielectric property of methylsilsesquioxane/high-temperature porogen hybrids and porous low-k films [J] . Mu-Lung Che, Jun-Yuan Teng, Po-Cheng Lai, Journal of Materials Research . 2011,第23期

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2. Structure-property relationships for nano-porous poly(methyl-silsesquioxane) films with low-dielectric constants prepared via organic/inorganic polymer hybrids [J] . Cattien V. Nguyen, Robert B. Beyers, Craig J. Hawker, Polymer Preprints . 1999,第1期

机译：通过有机/无机聚合物杂化制备的低介电常数纳米多孔聚（甲基倍半硅氧烷）薄膜的结构-性质关系
3. Study of nano-mechanical properties for thin porous films through instrumented indentation: SiO_2 low dielectric constant films as an example [J] . M. Herrmann, F. Richter, S.E. Schulz Microelectronic Engineering . 2008,第10期

机译：通过仪器压痕研究多孔薄膜的纳米力学性能：以SiO_2低介电常数薄膜为例
4. Study on the dielectric properties of hybrid and porous polyimide-silica films [C] . Yihe Zhang, Qingsong Su, Li Yu, International Conference on Multifunctional Materials and Structures . 2008

机译：杂交和多孔聚酰亚胺 - 二氧化硅膜的介电性能研究
5. Mechanical reliability of porous low-k dielectrics for advanced interconnect: Study of the instability mechanisms in porous low-k dielectrics and their mediation through inert plasma induced re-polymerization of the backbone structure. [D] . Sa, Yoonki. 2015

机译：用于高级互连的多孔低k电介质的机械可靠性：多孔低k电介质的不稳定性机理及其通过惰性等离子体引发的骨架结构再聚合的介导研究。
6. Influence of Coagulation Bath Temperature on the Structureand Dielectric Properties of Porous Polyimide Films in Different SolventSystems [O] . Panpan Zhang, *, Ke Zhang, 2020

机译：凝固浴温对结构的影响不同溶剂中多孔聚酰亚胺膜的介电性能系统
7. Study on the dielectric properties of hybrid and porous polyimide-silica films [O] . Zhang Y, Su Q, Yu L, 2008

机译：混合和多孔聚酰亚胺-二氧化硅薄膜的介电性能研究

Study on the dielectric properties of hybrid and porous polyimide-silica films

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