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Practical application of GaAs MMIC technology to next-generation 20 / 30 GHz data communication systems

机译:GaAs MMIC技术在下一代20/30 GHz数据通信系统中的实际应用

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摘要

Each year GaAs MMIC technology finds greater application in high volume, low-cost telecommunications systems. Cellular and PCS front-end chip-sets currently form the bulk of commercial GaAs MMIC products, but next generation systems now in design will require two-way data communications at 20 and 30 GHz. Infrastructure will be developed for both terrestrial (ground terminal) as well as space-based (satellite) interfaces for these new systems. This paper presents an overview of some of the GaAs MMIC chip-sets currently being designed to meet the requirements of these new 20 / 30 GHz systems, and examples are presented outlining some of the MMIC performance that has been achieved to date in prototype efforts. This paper also describes how GaAs MMIC technology might be packaged for integration with transmit and receive sub-systems. In some cases options are presented, and how these options might affect the resulting front-end designs are discussed. Finally, the challenges facing the technology implementation are outlined, and where possible, efforts aimed at overcoming the limitations of the technology are presented as practical solutions which could be available as production methods by the time these new systems are ready for high-volume production.
机译:每年,GaAs MMIC技术都会在高容量,低成本的电信系统中得到更大的应用。目前,蜂窝和PCS前端芯片组构成了商用GaAs MMIC产品的主体,但是目前正在设计的下一代系统将需要20 GHz和30 GHz的双向数据通信。将为这些新系统的地面(地面终端)和天基(卫星)接口开发基础设施。本文概述了目前为满足这些新的20/30 GHz系统要求而设计的某些GaAs MMIC芯片组,并提供了一些示例,概述了迄今为止在原型工作中已经实现的某些MMIC性能。本文还介绍了如何封装GaAs MMIC技术以与发射和接收子系统集成。在某些情况下,将介绍一些选项,并讨论这些选项如何影响最终的前端设计。最后,概述了技术实施所面临的挑战,并在可能的情况下,将旨在克服技术局限性的努力作为实际解决方案进行介绍,这些解决方案可以在这些新系统准备进行大批量生产时作为生产方法使用。

著录项

  • 作者

    Alm Roberto;

  • 作者单位
  • 年度 1998
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  • 原文格式 PDF
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