Flip-chip for space applications : Bonding reliability, DC and RF results.

摘要

This paper presents a study of flip-chip bonding for space applications. DC and mechanical test vehicles have demonstrated the reliability of the flip-chip gold-gold thermocompression bonding up to 500 thermal cycles. RF test vehicles have proved the compatibility of both coplanar and microstrip on-the-shelves MMICs with the flip-chip bonding up to 35 GHz. ud