A 3D wideband package solution using MCM-D BCB technology for tile TR module

摘要

This paper describes the works performed on a solution of packaging dedicated to 3D TR modules in the 2-20GHz frequency range. The proposed solution is based on a non hermetic architecture involving organic and BCB substrates. The studied key bricks relative to assembly, vertical interconnections, passives integration are described and results consecutive to electrical and environmental evaluation are presented. A 3D TR module demonstrator taking benefit from the key bricks evaluated through test vehicles has been realised and its performances measured when submitted to airborne environmental constraints.