This paper presents an overview of recent trends in millimeter-wave packaging and module technology development in Japan. For commercial millimeter-wave applications such as wireless radio links, wireless LANs, automotive radars and so on, packaging and module technologies with high performance and productivity are required. Ceramic-base packages up to W-band, flip-chip bonding and packaging of CPW MMICs for low cost and high reproducible assembling, and extremely compact multi-layer HTCC transmitter/receiver MCMs for 60GHz band communications, have been developed.
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