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The First 0.15um MHEMT 6 ”GaAs Foundry Service: Highly Reliable Process for 3 V Drain Bias Operations

机译:首款0.15um MHEMT 6” GaAs铸造服务:3 V漏极偏置操作的高度可靠工艺

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摘要

Lattice matched InAlAs/InGaAs/InP HEMTs have performance advantages over more commonly used GaAs PHEMTs due to the high electron velocity and carrier density >1 @. However,manufacturing these devices at high production level is difficult due to the limited size,high cost,and brittle nature of the InP substrate.Growing InAlAs/InGaAs structures metamorphically on GaAs substrates can overcome these substrate issues.However,the ultimate acceptance of MHEMT in commercial application depends upon its providing higher performance compared to other technologies at the same cost.In order to address the needs for both high performance and low manufacturing cost,for the first time,an highly reliable 4 mil 0.15 um MHEMT process has been developed on six inch GaAs substrates with high yield and reproducibility for both power and noise applications.
机译:晶格匹配的InAlAs / InGaAs / InP HEMT具有比更常用的GaAs PHEMT更高的性能优势,这归因于其高电子速度和> 1的载流子密度。然而,由于InP衬底的尺寸有限,成本高和易碎性,难以以高产量制造这些器件。在GaAs衬底上变质地生长InAlAs / InGaAs结构可以克服这些衬底问题。但是,MHEMT的最终接受在商业应用中,要依靠它以相同的成本提供比其他技术更高的性能。为了同时满足高性能和低制造成本的需求,首次开发了高度可靠的400万0.15 um MHEMT工艺在功率和噪声应用中具有高产量和可重复性的六英寸GaAs衬底上。

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