Flip chip and tab interconnects for millimeter wave MMICs - A comprehensive study

摘要

This paper presents simulation results performed with a 3D FEM Software on flip chip and tape automated bonding interconnect of MMICs at millimeter wave frequencies (40 - 60 Ghz). Parasitic propagation modes for CPW flip chip mounted MMICs are pointed out with proposed solution. Measurement results obtained with LNA 38 and 55 GHz microstrip MMICs connected to alumina substrates with a 50 Ohm coplanar tape are presented and show goodagreement compared to bare MMICs and to simulations.