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Submicron lateral scaling of HBTs and other vertical-transport devices:towards THz bandwidths

机译:HBT和其他垂直传输设备的亚微米横向缩放:朝太赫兹带宽

摘要

With appropriate device structures, bined lithographi and epitaxial scaling of HBTs,RTDs and S hottky diodes results in rapid in reases in device bandwidths.0.1 ¹m InGaAs RTDs have os illated at 650 GHz,Submi ron heterojunction bipolar sistors (HBTs)fabri ated with substrate transfer pro-esses have obtained 21 dB unilateral power gain at 100 GHz;if extrapolated at -20 dB/decade,this corresponds to a 1.1 THz power-gain uto ®frequency.HBT current-gain uto ®frequencies as high as 300 GHz have been obtained.
机译:有了适当的器件结构,HBT,RTD和S hottky二极管的平版印刷术和外延缩放可以迅速提高器件带宽。0.1¹mInGaAs RTD的振荡频率为650 GHz,用衬底制造的亚微米异质结双极晶体管(HBT)传输过程在100 GHz时已获得21 dB单边功率增益;如果以-20 dB /十倍频推算,则相当于1.1 THz功率增益uto®频率.HBT电流增益uto®频率高达300 GHz已获得。

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