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Integrated Substrate Packaging Based on LTCC and HTCC Technologies for Highly Integrated Space Equipment

机译：基于LTCC和HTCC技术的集成衬底封装，用于高度集成的太空设备

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Di Marcantonio U.; Di Nardo I.; Tursini M.; Comparini M.C.; Novello R.; Leone C.;
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1. Highly Integrated Millimeter-Wave Passive Components Using 3-D LTCC System-on-Package (SOP) Technology [J] . Jong-Hoon Lee, Gerald DeJean, Saikat Sarkar, IEEE Transactions on Microwave Theory and Techniques . 2005,第6期

机译：采用3-D LTCC封装系统（SOP）技术的高度集成毫米波无源元件
2. Antenna-in-package system integrated with meander line antenna based on LTCC technology [J] . Gang?Dong, Wei?Xiong, Zhao-yao?Wu, Frontiers of Information Technology & Electronic Engineering . 2016,第1期

机译：基于LTCC技术与曲折线天线集成的封装天线系统
3. Antenna-in-package system integrated with meander line antenna based on LTCC technology [J] . Gang DONG, Wei XIONG, Zhao-yao WU, 浙江大学学报（英文版）（C辑：计算机与电子） . 2016,第001期

机译：基于LTCC技术与曲折线天线集成的封装天线系统
4. A Highly Integrated 3-D Millimeter-Wave Filter Using LTCC System-on-Package (SOP) Technology for V-band WLAN Gigabit Wireless Systems [C] . J.-H.Lee, N. Kidera, S. Pinel, 2005 Asia-Pacific Microwave Conference Proceedings vol.1: Microwaves Make People Closer . 2005

机译：使用LTCC封装系统（SOP）技术的V波段WLAN千兆无线系统的高度集成3-D毫米波滤波器
5. Highly integrated three dimensional millimeter-wave passive front-end architectures using system-on-package (SOP) technologies for broadband telecommunications and multimedia/sensing applications. [D] . Lee, Jong-Hoon. 2007

机译：使用系统级封装（SOP）技术的高度集成的三维毫米波无源前端体系结构，用于宽带电信和多媒体/传感应用。
6. Half-spaced substrate integrated spoof surface plasmon polaritons based transmission line [O] . Jian Feng Zhu, Shao Wei Liao, Shu Fang Li, -1

机译：半间隔基片集成的基于仿造表面等离子体激元极化子的传输线
7. Integrated Substrate Packaging Based on LTCC and HTCC Technologies for Highly Integrated Space Equipment [O] . Di Marcantonio U., Di Nardo I., Tursini M., 2003

机译：基于LTCC和HTCC技术的集成衬底封装，用于高度集成的太空设备
8. Integrated Instrumentation and Sensor Systems Enabling Condition-Based Maintenance of Aerospace Equipment. [R] . Millar, R. C. 2012

机译：集成仪表和传感器系统实现航空航天设备的基于状态的维护。

Integrated Substrate Packaging Based on LTCC and HTCC Technologies for Highly Integrated Space Equipment

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