A novel package approach for multichip modules based on anisotropic conductive adhesives

摘要

In this paper anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for cavity-up millimeter-wave packages simultaneously featuring small size, electrical and mechanical interconnection as well as heat transfer capabili-ties is presented.