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Low noise amplifiers in SiGe hetero-junction bipolar process using reduced pressure chemical vapor deposition

机译:采用减压化学气相沉积的SiGe异质结双极工艺中的低噪声放大器

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摘要

In this paper,,an economic SiGe HBT (hetero- junction bipolar transistor)process using reduced pressure chemical vapor deposition (RPCVD)process of high throughput and the cheap localized oxidation of silicon (LOCOS)instead of shallow trench,was developed and characterized.To test its feasibility,several low noise amplifiers were designed and fabricated.As well as high cutoff frequency and low noise SiGe HBT devices,the passive elements including planar spiral inductors with only two metal layers,metal-insulator-metal capacitor,three kinds of resistors,and varactor diode were also integrated in the process.With carefully designing of the base profile and adopting finger-type structure,the measured minimum noise figure of 1.5 dB and associated gain of 16 dB at 1.8 GHz consuming the collector current of 4.6 mA at the supply voltage of 2.5V,were obtained in the low noise device.After on-wafer calibration,one of the fabricated low noise amplifiers was measured as 2.5 dB NF and 21 dB insertion gain at the frequency of 1.8 GHz with the supply voltage of 2.5 V.Those results using the epitaxial growth by RPCVD are firstly reported,and show its possibility to RF arena.ud
机译:本文开发并表征了一种经济的SiGe HBT(异质结双极晶体管)工艺,该工艺使用高通量和廉价的硅局部氧化(LOCOS)而不是浅沟槽的低压化学气相沉积(RPCVD)工艺进行了表征。为了测试其可行性,设计和制造了多个低噪声放大器。以及高截止频率和低噪声SiGe HBT器件,无源元件包括仅具有两个金属层的平面螺旋电感器,金属-绝缘体-金属电容器,三种电阻和变容二极管也集成在该过程中。通过仔细设计基本外形并采用指形结构,在1.8 GHz时测得的最小噪声系数为1.5 dB,相关增益为16 dB,消耗了4.6 mA的集电极电流在低噪声器件中获得了2.5V的电源电压。在进行晶圆上校准后,制造的一个低噪声放大器的测量值为2.5 dB NF和21 dB ins在电源电压为2.5 V的情况下,在1.8 GHz频率下的安装增益。首先报道了使用RPCVD外延生长的结果,并表明了其在RF领域的可能性。 ud

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