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RF Noise and Power Performances of AlGaN/GaN onudSi(111) Substrates making of low cost modules.

机译:AlGaN / GaN的射频噪声和功率性能Si(111)低成本模块的基板制造。

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摘要

High performances was achieved on AlGaN/GaN HEMTs based on Si(111). Devices with 0.17-µm and 0.3-µm gate lengths are fabricated on two different layer growth at TIGER laboratory. RF noise and power performances are carried out on these transistors. udThe 0.17 x 100 µm2 devices exhibit a unity current gain cutoffudfrequency (ft) of 46 GHz, and a maximum frequency (fmax)udof 92 GHz at VDS = 10 V. Also, a minimum noise figureud(NFmin) of 1.1 dB and an available associated gain (Gass) ofud12 dB are obtained at VDS = 10 V and f = 10 GHz. The 0.3 ud300 µm2 devices demonstrate a drain-to-source currentuddensity Ids = 925 mA/mm at VGS = 0 V and a maximumudextrinsic transconductance (Gm) of 250 mS/mm.udFurthermore, a high output power density of 1.9 W/mmudassociated to a PAE of 18% and a linear gain of 16 dB areudmeasured at f = 10 GHz and VDS = 30 V.udThese performances are the best ever reported for AlGaN/GaNudHEMTs based on silicon substrates at this frequency.
机译:在基于Si(111)的AlGaN / GaN HEMT上实现了高性能。 TIGER实验室在两种不同的层生长条件下制造出栅长为0.17 µm和0.3 µm的器件。这些晶体管具有RF噪声和功率性能。 ud0.17 x 100 µm2器件在VDS = 10 V时表现出46 GHz的统一电流增益截止 ud频率(ft),最大频率(fmax) udof 92 GHz。此外,最小噪声系数 ud(NFmin)在VDS = 10 V和f = 10 GHz时可获得1.1 dB的增益和可用的相关增益(Gass) ud12 dB。 0.3 ud300 µm2的器件在VGS = 0 V时显示出漏极到源极电流密度Ids = 925 mA / mm,最大非本征跨导(Gm)为250 mS / mm。 ud此外,输出功率密度高在f = 10 GHz和VDS = 30 V时测得1.9 W / mm的功率/与18%的PAE和16 dB的线性增益相关联。 ud这些性能是AlGaN / GaN udHEMT基于硅基板在此频率。

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