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Electrothermal harmonic balance simulation of an INGAP/GAAS HBT based on 3D thermal and semiconductor transport models

机译:基于3D热和半导体传输模型的INGAP / GAAS HBT电热谐波平衡仿真

摘要

A parallel implementation of the direct coupling of InGaP/GaAs HBT transport equations has been included in an Harmonic Balance simulator. Several results such as a class AB amplifier for mobile communication study and a stability analysis of “crunch effect” in multi-finger HBT have been performed.
机译:InGaP / GaAs HBT输运方程式直接耦合的并行实现已包含在谐波平衡模拟器中。已经执行了一些结果,例如用于移动通信的AB类放大器以及对多指HBT中“紧缩效应”的稳定性分析。

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