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Microwave and DC Performance of AlGaN/GaN HEMTs Grown on Si using a New Growth Technique

机译:使用新的生长技术在硅上生长的AlGaN / GaN HEMT的微波和直流性能

摘要

RF performance and improved DC characteristics were observed for GaN-based HEMTs using epitaxial layers grown on silicon via the SIGANTIC™ growth technique. The AlGaN/GaN HEMTs employed optical gate lithography (Lg = 1 µm) in the two-finger pi configuration. Measured devices exhibited good DC performance, with maximum transconductance and current densities of 110 mS/mm and 470 mA/mm respectively. A special technique based on current injection was used for performance evaluation and drain-to-source breakdown voltages VDS BD ~ 25 V – 35 V were observed. Microwave characteristics for these devices were also promising, where high current gain and maximum power gain frequencies of 5.9 GHz and 12 GHz, respectively.
机译:使用通过SIGANTIC™生长技术在硅上生长的外延层,对基于GaN的HEMT观察到了RF性能和改善的DC特性。 AlGaN / GaN HEMT采用两指pi构造的光学栅极光刻技术(Lg = 1 µm)。被测设备表现出良好的直流性能,最大跨导和电流密度分别为110 mS / mm和470 mA / mm。使用基于电流注入的特殊技术进行性能评估,并观察到漏极至源极的击穿电压VDS BD〜25 V – 35V。这些设备的微波特性也很有希望,其高电流增益频率和最大功率增益频率分别为5.9 GHz和12 GHz。

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