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Characteristics of InGaP/GaAs single- heterojunction bipolar transistor with zero potential-spike by δ-doped sheet

机译:δ掺杂薄板零电位尖峰InGaP / GaAs单异质结双极晶体管的特性

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摘要

We report the fabrication and characterization of the InGaP/GaAs single het­erojunction bipolar transistor (SHBT). The cross sectional structure of the studied device is shown in Fig.l. The SHBT with a delta-doped sheet located at the E-B heterointerface (delta-SHBT) exhibits a common-emitter current gain as high as 410 and an extremely low offset voltage of only 55 mV. Figure 2(a) and (b) illustrate the I-V characteristics and the expanded view near the near of the same device. The higher current gain of delta-SHBT can be attributed to the increase of the hole barrier resulting from the delta-doped sheet and to the reduction of charge storage because of the existence of thin spacer (50-A). The low offset voltage is due to the elimination of the potential spike of E-B junction. The calculated conduction band-edge dia­grams near the E-B junction of delta-SHBT, conventional SHBT and HEBT at various biased conditions are plotted in Fig.3. At equilibrium, no potential spike exists for all the three structures. As Vbe= + 1.0 V forward biased, a potential spike about 60 meV existed in an SHBT while no potential spike existed in both delta-SHBT and HEBT. Also notice that the width of neutral region in narrow energy-gap emitter for an HEBT is also increased with biased voltage. It is evident that the potential spike do be eliminated by utilizing delta-doped sheet. On the other hand, calculated increase of the E-B capacitance for our delta-SHBT is very small due to the thin enough delta-doped sheet.
机译:我们报告了InGaP / GaAs单异质结双极晶体管(SHBT)的制造和表征。被研究设备的横截面结构如图1所示。位于E-B异质界面的δ掺杂薄板的SHBT(delta-SHBT)具有高达410的共发射极电流增益和仅55 mV的极低失调电压。图2(a)和(b)示出了I-V特性和同一器件附近的放大图。 δ-SHBT的较高电流增益可归因于由于掺有δ的薄板而导致的空穴势垒的增加以及由于存在较薄的间隔物(50-A)而导致的电荷存储的减少。低失调电压是由于消除了E-B结的潜在尖峰。图3中绘制了在各种偏置条件下,δ-SHBT,常规SHBT和HEBT的E-B结附近的计算导带边图。在平衡状态下,所有三个结构都不存在潜在的峰值。当Vbe = + 1.0 V正向偏置时,SHBT中存在大约60 meV的电势尖峰,而delta-SHBT和HEBT中均不存在电势尖峰。还要注意,HEBT的窄能隙发射极中性区的宽度也随偏置电压而增加。明显的是,通过利用掺do薄片可以消除潜在的尖峰。另一方面,由于足够薄的三角形掺杂片,计算出的三角形SHBT的E-B电容的增加非常小。

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