Multiwafer metalorganic vapor phase epitaxy (MOVPE) present several advantages over other epitaxial growth technologies. These production oriented advantages are extremely uniformity of layer thickness, doping and composition, low defect density and highly efficient utilization of the precursor. These advantages result in a low cost of ownership and in a low cost for the epilayer growth process. In this contribution the status of the current industrial standard of the AIXTRON Planetary Reactor® currently used in production for HFET, HBT, LED, lasers and detectors is reviewed. The main features of this reactor concept is the high flexibility in reactor size (15 x 2", 35 x 2", 9 x 4", 5 x 6" wafer load) and the automated cassette-to-cassette wafer loading system. Starting with the industrial specifications required for the epitaxial growth of electronic devices such as layer thickness uniformity of less than 1%, p and n type doping uniformity of 1% and a defect density on the wafer of less than 1 cm2 we show the recently obtained results from industrial applications. Production processes for HFET used in MMIC and for HBT applied in mobile communication systems will be discussed in detail. Further challenges arising from high speed optoelectronic devices such as the handling of phosphorous containing compounds will be shown to give an idea for further applications of the MOVPE process.
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机译:与其他外延生长技术相比,多晶片金属有机气相外延(MOVPE)具有多个优势。这些以生产为导向的优点是层厚度,掺杂和组成极为均匀,缺陷密度低和前驱物的高效利用。这些优点导致较低的拥有成本和较低的外延层生长过程成本。在此贡献中,回顾了当前用于HFET,HBT,LED,激光器和探测器的生产中使用的AIXTRON行星反应堆®的当前工业标准的状况。该反应堆概念的主要特征是反应堆尺寸(15 x 2“,35 x 2”,9 x 4“,5 x 6”晶片装载)和高度灵活的盒对盒晶片装载系统具有高度灵活性。从电子设备外延生长所需的工业规格开始,例如层厚度均匀度小于1%,p型和n型掺杂均匀度为1%,晶圆上的缺陷密度小于1 cm2,我们证明了最近获得的结果工业应用的结果。将详细讨论MMIC中使用的HFET和移动通信系统中使用的HBT的生产过程。高速光电器件带来的其他挑战,例如含磷化合物的处理,将被证明为MOVPE工艺的进一步应用提供了思路。
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