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SU-8 Based MEMS Process with Two Metal Layers using α-Si as a Sacrificial Material

机译:基于SU-8的具有两个金属层的MEMS工艺,使用α-Si作为牺牲材料

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摘要

Polymer based microelectromechanical systems (MEMS) micromachining is finding more interest in research and applications. This is due to its low cost and less time processing compared with silicon MEMS. SU-8 is a photo-patternable polymer that is used as a structural layer for MEMS and microfluidic devices. In addition to being processed with low cost, it is a biocompatible material with good mechanical properties. Also, amorphous silicon (α-Si) has found use as a sacrificial layer in silicon MEMS applications. α-Si can be deposited at large thicknesses for MEMS applications and also can be released in a dry method using XeF2 which can solve stiction problems related to MEMS applications. In this thesis, an SU-8 MEMS process is developed using amorphous silicon (α-Si) as a sacrificial layer. Electrostatic actuation and sensing is used in many MEMS applications. SU-8 is a dielectric material which limits its direct use in electrostatic actuation. This thesis provides a MEMS process with two conductive metal electrodes that can be used for out-of-plane electrostatic applications like MEMS switches and variable capacitors. The process provides the fabrication of dimples that can be conductive or non-conductive to facilitate more flexibility for MEMS designers. This SU-8 process can fabricate SU-8 MEMS structures of a single layer of two different thicknesses. Process parameters were tuned for two sets of thicknesses which are thin (5-10μm) and thick (130μm).Chevron bent-beam structures and different suspended beams (cantilevers and bridges) were fabricated to characterize the SU-8 process through extracting the density, Young’s Modulus and the Coefficient of Thermal Expansion (CTE) of SU-8. Also, the process was tested and used as an educational tool through which different MEMS structures were fabricated including MEMS switches, variable capacitors and thermal actuators.
机译:基于聚合物的微机电系统(MEMS)微加工在研究和应用中越来越引起人们的兴趣。与硅MEMS相比,这是由于其低成本和较少的处理时间。 SU-8是一种可光图案化的聚合物,可用作MEMS和微流体设备的结构层。除了以低成本进行加工外,它还是一种具有良好机械性能的生物相容性材料。而且,发现非晶硅(α-Si)用作硅MEMS应用中的牺牲层。 α-Si可以以较大的厚度沉积以用于MEMS应用,也可以使用XeF2以干法释放,这可以解决与MEMS应用相关的静摩擦问题。本文以非晶硅(α-Si)作为牺牲层,开发了一种SU-8 MEMS工艺。在许多MEMS应用中使用静电致动和感应。 SU-8是一种介电材料,限制了其直接用于静电致动。本文提供了一种具有两个导电金属电极的MEMS工艺,可用于MEMS开关和可变电容器等平面外静电应用。该工艺提供了可以导电或不导电的凹痕的制造,以促进MEMS设计人员的更大灵活性。这种SU-8工艺可以制造具有两种不同厚度的单层SU-8 MEMS结构。针对薄(5-10μm)和厚(130μm)的两组厚度调整工艺参数,制造了雪佛龙弯梁结构和不同的悬梁(悬臂和桥),以通过提取密度来表征SU-8工艺,杨氏模量和SU-8的热膨胀系数(CTE)。此外,该过程经过测试并用作教学工具,通过该工具可以制造出包括MEMS开关,可变电容器和热执行器在内的各种MEMS结构。

著录项

  • 作者

    Ramadan Khaled S.;

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  • 年度 2012
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  • 原文格式 PDF
  • 正文语种 en
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