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Two-step controllable electrochemical etching of tungsten scanning probe microscopy tips

机译:钨扫描探针显微镜尖端的两步可控电化学蚀刻

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摘要

Dynamic electrochemical etching technique is optimized to produce tungsten tips with controllable shape and radius of curvature of less than 10 nm. Nascent features such as dynamic electrochemical etching and reverse biasing after drop-off are utilized, and two-step dynamic electrochemical etching is introduced to produce extremely sharp tips with controllable aspect ratio. Electronic current shut-off time for conventional dc drop-off technique is reduced to ?36 ns using high speed analog electronics. Undesirable variability in tip shape, which is innate to static dc electrochemical etching, is mitigated with novel dynamic electrochemical etching. Overall, we present a facile and robust approach, whereby using a novel etchant level adjustment mechanism, 30° variability in cone angle and 1.5 mm controllability in cone length were achieved, while routinely producing ultra-sharp probes. © 2012 American Institute of Physics.
机译:动态电化学蚀刻技术经过优化,可生产形状和曲率半径小于10 nm的可控钨尖。利用了诸如动态电化学蚀刻和落下后的反向偏压等新生特征,并引入了两步动态电化学蚀刻以产生具有可控长宽比的极其尖锐的尖端。使用高速模拟电子器件,传统直流降压技术的电流截止时间减少到了?36 ns。尖端的形状不希望有的变化是静态直流电化学蚀刻所固有的,可以通过新型动态电化学蚀刻来缓解。总体而言,我们提出了一种简便而稳健的方法,通过使用一种新颖的蚀刻剂液位调节机制,可以实现锥角30°的变化和锥长1.5 mm的可控制性,同时可以常规生产超锐利的探头。 ©2012美国物理研究所。

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