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Movable MEMS Devices on Flexible Silicon

机译:柔性硅上的可移动MEMS器件

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摘要

Flexible electronics have gained great attention recently. Applications such as flexible displays, artificial skin and health monitoring devices are a few examples of this technology. Looking closely at the components of these devices, although MEMS actuators and sensors can play critical role to extend the application areas of flexible electronics, fabricating movable MEMS devices on flexible substrates is highly challenging. Therefore, this thesis reports a process for fabricating free standing and movable MEMS devices on flexible silicon substrates; MEMS flexure thermal actuators have been fabricated to illustrate the viability of the process. Flexure thermal actuators consist of two arms: a thin hot arm and a wide cold arm separated by a small air gap; the arms are anchored to the substrate from one end and connected to each other from the other end. The actuator design has been modified by adding etch holes in the anchors to suit the process of releasing a thin layer of silicon from the bulk silicon substrate. Selecting materials that are compatible with the release process was challenging. Moreover, difficulties were faced in the fabrication process development; for example, the structural layer of the devices was partially etched during silicon release although it was protected by aluminum oxide which is not attacked by the releasing gas . Furthermore, the thin arm of the thermal actuator was thinned during the fabrication process but optimizing the patterning and etching steps of the structural layer successfully solved this problem. Simulationwas carried out to compare the performance of the original and the modified designs for the thermal actuators and to study stress and temperature distribution across a device. A fabricated thermal actuator with a 250 μm long hot arm and a 225 μm long cold arm separated by a 3 μm gap produced a deflection of 3 μm before silicon release, however, the fabrication process must be optimized to obtain fully functioning devices on flexible silicon.
机译:柔性电子产品最近引起了极大的关注。诸如柔性显示器,人造皮肤和健康监测设备之类的应用就是该技术的一些示例。仔细观察这些设备的组件,尽管MEMS致动器和传感器在扩展柔性电子设备的应用领域中可以发挥关键作用,但在柔性基板上制造可移动MEMS器件仍具有很高的挑战性。因此,本论文报道了一种在柔性硅衬底上制造独立式和可移动式MEMS器件的工艺。 MEMS挠性热致动器已经被制造出来以说明该过程的可行性。挠性热执行器由两根臂组成:一个细小的热臂和一个宽的冷臂,由小的气隙隔开;臂从一端固定到基底,并从另一端互相连接。通过在锚固件中添加蚀刻孔对执行器设计进行了修改,以适应从大块硅基板上释放薄薄的一层硅的过程。选择与释放过程兼容的材料具有挑战性。此外,在制造工艺开发中面临困难。例如,尽管器件的结构层受到了氧化铝的保护,但并未受到释放气体的侵蚀,但该结构层在硅释放期间被部分蚀刻。此外,热致动器的细臂在制造过程中变薄,但是优化结构层的构图和蚀刻步骤成功地解决了这个问题。进行了仿真以比较热执行器的原始设计和改进设计的性能,并研究整个设备上的应力和温度分布。具有250μm长的热臂和225μm长的冷臂(相隔3μm间隙)的制造的热执行器在释放硅之前产生了3μm的挠度,但是,必须优化制造工艺以在柔性硅上获得功能齐全的器件。

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