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Mécanismes de consolidation et de densification de poudres de cuivre lors d'un frittage SPS

机译:SPS烧结过程中铜粉的固结和致密化机理

摘要

Spark plasma sintering is a manufacturing process that leads to dense materials with fine microstructures. SPS combines heating and uniaxial load as well as the Hot Pressing (HP) process but the material is heated using a pulsed current. The phenomena occurring during SPS are not fully understood and are still an open point: -Which densification and consolidation mechanisms are involved during SPS? -Why is sintering by SPS more efficient than sintering by traditional ways such as HP? –Does electrical current modify the sintering mechanisms? The aim of this work is to answer these questions in the case of spherical copper powder (from 10 to 50 µm). Comparisons between SPS and HP were performed using the same process conditions. The densification rate was studied macroscopically and microscopically. The evolution of the necks between particles was followed by cross sections and fractography. The densification is realized by plastic deformation due to the applied load and the temperature increase. No difference between SPS and HP was observed although sintering conditions favorable to the occurrence of specific phenomena were applied: oxide layer coating the particles, current forced through the sample, high intensity using a pulsed current. In the studied conditions, no specific effect was observed due to the current presence.
机译:火花等离子体烧结是一种制造过程,可产生具有精细微结构的致密材料。 SPS结合了加热和单轴负载以及热压(HP)工艺,但是使用脉冲电流加热了材料。 SPS期间发生的现象尚未完全了解,仍然是一个开放点:-SPS涉及哪些致密化和固结机制? -为什么用SPS进行烧结比使用HP等传统方法进行烧结更有效率? –电流会改变烧结机理吗?这项工作的目的是在球形铜粉(10至50 µm)的情况下回答这些问题。使用相同的工艺条件对SPS和HP进行比较。宏观和微观研究致密化率。颗粒之间的颈状演化随后是截面和分形照相。通过施加的载荷和温度升高,塑性变形实现致密化。尽管采用了有利于发生特定现象的烧结条件,但未观察到SPS与HP之间的差异:涂覆颗粒的氧化物层,迫使电流通过样品,使用脉冲电流的高强度。在研究的条件下,由于当前的存在,未观察到任何特定作用。

著录项

  • 作者

    Collet Romaric;

  • 作者单位
  • 年度 2015
  • 总页数
  • 原文格式 PDF
  • 正文语种 fr
  • 中图分类
  • 入库时间 2022-08-20 20:24:43

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