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Étude et réalisation de Transistors Bipolaires à Hétérojonction InP/GaAsSb/InP reportés sur substrat hôte pour application à la puissance

机译:InP / GaAsSb / InP异质结双极晶体管转移到衬底上的应用研究与实现。

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摘要

This thesis is focused on study, fabrication and characterization of heterojunction bipolartransistors (HBT) where GaAsSb-based active layers are transferred to a host substrate. Thegoal of this study is to provide the basis of the transistor design for power and high speedapplications.The simulation allowed to introduce, for transferred-substrate transistors, the concepts ofthermal drain taking advantage of the metal layer used by the transferred substratetechnique. It has been shown that on a substrate of poor thermal conductivity as Pyrex, thetransferred substrate technique leads to a reduction of the thermal resistance of more than30%. On a substrate of high thermal conductivity this reduction factor is as high as six.Based on these concepts, HBT fabrication technology on transferred substrate layers byanodic bonding has been developed. The fabrication of double mesa HBTs has beendemonstrated. Two difficulties have been identified in the fabrication process for highspeedHBTs.Electrical characterizations have allowed to attribute the excess of base current usuallyobserved in InP/GaAsSb heterojunctions to the antimony contents in the InP emitter layer.The absence of antimony in the emitter layer when it is grown before the base layer, as inthe case of transfered-susbtrate HBTs, cancel this parasitic effect and leads to transistorsexhibiting current gain which are independent of the collector current.On the other hand, the heating effects on the HBT electrical characteristics have beensystematically studied in order to provide guidelines in the HBT design for powerapplications. Thanks to its type II heterojunction, GaAsSb/InP HBTs present a thermoelectriccoefficient much smaller (better themal stability) than HBT using type I heterojonctions.The minority electron lifetime in GaAsSb:C is limited by Auger-type recombinations. As aresult the GaAsSb-based HBTs have a temperature constant current gain on a wide temperaturerange.All these electrical properties demonstrate that the transfered-substrate InP/GaAsSb HBTshave much better electrical and thermal stability than other HBTs. Therefore they have alarge potential for power applications.
机译:本文的重点是异质结双极晶体管(HBT)的研究,制造和表征,其中基于GaAsSb的有源层转移到主体衬底上。本研究的目标是为功率和高速应用提供晶体管设计的基础。该模拟允许为转移衬底晶体管引入利用转移衬底技术所使用的金属层的散热概念。已经表明,在导热性较差的衬底(如派热克斯)上,转移衬底技术导致热阻降低30%以上。在高导热率的衬底上,该减小因子高达六。基于这些概念,已经开发了通过阳极键合在转移的衬底层上的HBT制造技术。已经证明了双台面HBT的制造。在高速HBT的制造过程中发现了两个困难:电气特性已将InP / GaAsSb异质结中通常观察到的基极电流过多归因于InP发射极层中的锑含量。与转移过的HBT一样,在基极层之前生长的BBS消除了这种寄生效应并导致晶体管表现出的电流增益与集电极电流无关。另一方面,对HBT电学特性的加热效应进行了系统研究。为了在HBT设计中为电源应用提供指导。由于其II型异质结,GaAsSb / InP HBT的热电系数要比使用I型异质结的HBT小得多(更好的热稳定性).GaAsSb:C中的少数电子寿命受到俄歇型复合的限制。因此,基于GaAsSb的HBT在较宽的温度范围内具有恒定的温度增益。所有这些电学性能表明,转移衬底的InP / GaAsSb HBT比其他HBT具有更好的电稳定性和热稳定性。因此,它们在电力应用中具有很大的潜力。

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