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Studies on tin oxide films prepared by electron beam evaporation and spray pyrolysis methods

机译:电子束蒸发喷雾热解法制备氧化锡薄膜的研究

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摘要

Abstract. Transparent conducting tin oxide thin films have been prepared by electron beam evaporation and spray pyrolysis methods. Structural, optical and electrical properties were studied under different preparation conditions like substrate temperature, solution flow rate and rate of deposition. Resistivity of undoped evaporated films varied from 2.65× $10^{-2}$ $Omega-cm$ to 3.57× $10^{-3}$ $Omega-cm$ in the temperature range 150–200°C. For undoped spray pyrolyzed films, the resistivity was observed to be in the range 1.2 × $10^{-1}$ to 1.69 × $10^{-2}$ $Omega-cm$ in the temperature range 250–370°C. Hall effect measurements indicated that the mobility as well as carrier concentration of evaporated films were greater than that of spray deposited films. The lowest resistivity for antimony doped tin oxide film was found to be 7.74×$10^{-4}$ Omega-cm, which was deposited at 350°C with 0.26 g of $SbCl_3$ and 4 g of $SnCl_4$ $(SbCl_3/SnCl_4 = 0.065)$ .Evaporated films were found to be amorphous in the temperature range up to 200°C, whereas spray pyrolyzed films prepared at substrate temperature of 300–370°C were polycrystalline. The morphology of tin oxide films was studied using SEM.
机译:抽象。已经通过电子束蒸发和喷雾热解方法制备了透明导电氧化锡薄膜。研究了在不同的制备条件下的结构,光学和电学性质,例如衬底温度,溶液流速和沉积速率。在150–200°C的温度范围内,未掺杂的蒸发膜的电阻率从2.65×$ 10 ^ {-2} $ Omega-cm $变化到3.57×$ 10 ^ {-3} $ Omega-cm $。对于未掺杂的喷雾热解膜,在250–370°C的温度范围内,电阻率在1.2×10 ^ {-1} $至1.69×10 ^ {-2} $ Ω-cm$的范围内。霍尔效应测量表明,蒸发薄膜的迁移率和载流子浓度均大于喷涂薄膜。发现掺杂锑的氧化锡膜的最低电阻率为7.74×$ 10 ^ {-4} $ Ω-cm,该电阻率在350°C下沉积有0.26 g的$ SbCl_3 $和4 g的$ SnCl_4 $( SbCl_3 / SnCl_4 = 0.065)$。发现蒸发膜在高达200°C的温度范围内是非晶态的,而在300-370°C的基底温度下制备的喷雾热解膜是多晶的。用SEM研究了氧化锡膜的形貌。

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