首页> 外文OA文献 >Preparation And Characterization Of Calcium CopperudTitanate Filled Epoxy Composites For EmbeddedudCapacitor Applicationsud
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Preparation And Characterization Of Calcium CopperudTitanate Filled Epoxy Composites For EmbeddedudCapacitor Applicationsud

机译:钙铜 ud的制备与表征用于嵌入式 ud的钛酸酯填充环氧树脂复合材料电容器应用 ud

摘要

Continuous miniaturization of electronic devices result in a high demand ofudembedded capacitor that offers significant reduction in size, better dielectric andudthermal performance, reliability and lower cost. Polymer-ceramic composites haveudbeen considered as the most suitable dielectric materials for embedded capacitor. Inudthis study, ceramics such as calcium copper titanate, CaCu3Ti4O12 (CCTO) andudbarium titanate (BaTiO3) were used as fillers in epoxy thin film composites. Theudproperties of epoxy thin film composites fabricated based on different filler loadingud(5 to 20 vol%), fabrication methods such as spin coating (SC) and hot press (HP)udmethods, hybrid fillers (CCTO and BaTiO3), surface treatment of filler and variousudtypes of epoxy resins (DER 332, Epolam 2015 and OP 392) were characterized.udResults showed that CCTO/epoxy composite exhibited higher dielectric constant, Tgudand thermal conductivity compared to those of unfilled epoxy and BaTiO3/epoxyudcomposites. In the second series, CCTO filler filled epoxy composite was chosen forudfurther investigation. CCTO/epoxy composite with filler loading of up to 40 vol%udwas able to be produced by using HP method. It was found that 40 vol%udCCTO/epoxy (HP) composite has increased 55% of dielectric constant and 83% ofudstorage modulus, and decreased 69% of CTE compared to 20 vol% CCTO/epoxyud(SC) composite. Hybrid fillers composites were fabricated and results indicated thatudHybrid 70:30 showed positive hybrid effect compared to those of single fillerudcomposites; CCTO/epoxy and BaTiO3/epoxy thin film composites. After treatmentudof CCTO by silane-based coupling agent, sample with 10% treated CCTO filledudepoxy composite presented remarkable improvement with an increased 60% ofuddielectric constant than untreated CCTO/epoxy thin film composite. Based onudvarious epoxy resins, treated CCTO/OP 392 epoxy thin film composite has improvedud10% of dielectric constant and decreased 38% of CTE compared to 3M EmbeddedudCapacitor. In short, treated CCTO filled OP 392 epoxy thin film composite exhibitedudgood dielectric properties and thermal properties compared to those of untreatedudCCTO composites, hybrid fillers composites and other treated composites.
机译:电子设备的持续小型化导致对去电容器的大量需求,该电容器提供了尺寸的显着减小,更好的介电和耐高温性能,可靠性以及更低的成本。高分子陶瓷复合材料被认为是最适合嵌入式电容器的介电材料。在这项研究中,钛酸钙铜,CaCu3Ti4O12(CCTO)和钛酸钡(BaTiO3)等陶瓷用作环氧薄膜复合材料的填料。基于不同填料填充量 ud(5至20 vol%)制备的环氧薄膜复合材料的 ud性能,旋涂(SC)和热压(HP) udmethod等制备方法,混合填料(CCTO和BaTiO3),表征了填料的表面处理和各种类型的环氧树脂(DER 332,Epolam 2015和OP 392)。结果表明,与未填充的环氧树脂和BaTiO3相比,CCTO /环氧树脂复合材料具有更高的介电常数,Tg ud和导热性/ epoxy udcomposites。在第二系列中,选择CCTO填料填充的环氧复合材料进行进一步的研究。使用HP方法可以生产CCTO /环氧树脂复合材料,其填料填充量高达40 vol%。发现与20 vol%CCTO / epoxy ud(SC)复合材料相比,40 vol% udCCTO /环氧树脂(HP)复合材料的介电常数提高了55%,储能模量提高了83%,CTE降低了69%。 。制备了杂化填料复合材料,结果表明: udHybrid 70:30与单一填料 udcomposites相比具有积极的杂化效果。 CCTO /环氧树脂和BaTiO3 /环氧树脂薄膜复合材料。用硅烷基偶联剂处理CCTO后,与未处理的CCTO /环氧薄膜复合材料相比,使用10%处理过的CCTO填充去环氧复合材料制成的样品表现出显着的改善,其介电常数提高了60%。与3M Embedded udCapacitor相比,基于各种环氧树脂,经过处理的CCTO / OP 392环氧薄膜复合材料的介电常数提高了ud10%,CTE降低了38%。简而言之,与未处理的 udCCTO复合材料,杂化填料复合材料和其他处理的复合材料相比,经处理的CCTO填充的OP 392环氧薄膜复合材料表现出良好的介电性能和热性能。

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    Dandan Satia Mohd saidina;

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  • 年度 2015
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