Curvature Interferometry based In-Situ Measurement of Stresses Associated with Electrochemical Reactions

摘要

Anodization1 as well as dissolution2 of reactive metals such as aluminum results in buildup of significant levels of stresses on the reacting surface. In-situ measurement of stress evolution can provide remarkable insights into the associated electrochemical reactions and help in understanding the governing mechanisms. We report a curvature interferometry based technique for in-situ monitoring of stress evolution. Curvature interferometer is incorporated into the electrochemical cell and is used to monitor the curvature changes of the samples in order to determine the stress-thickness product of the film formed on the reacting surface.