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Analysis of Total Dose Induced Dark Current in CMOS Image Sensors from Interface State and Trapped Charge Density Measurements

机译:从接口状态和陷获电荷密度测量结果分析CMOS图像传感器中总剂量感应暗电流

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摘要

The origin of total ionizing dose induced dark current in CMOS image sensors is investigated by comparing dark current measurements to interface state density and trapped charge density measurements. Two types of photodiode and several thick-oxide-FETs were manufactured using a 0,18 um CMOS image sensor process and exposed to 10 keV X-ray from 3 krad to 1 Mrad. It is shown that the radiation induced trapped charge extends the space charge region at the oxide interface, leading to an enhancement of interface state SRH generation current. Isochronal annealing tests show that STI interface states anneal out at temperature lower than 100°C whereas about a third of the trapped charge remains after 30 minutes at 300°C.
机译:通过将暗电流测量结果与界面态密度和陷获电荷密度测量结果进行比较,研究了CMOS图像传感器中总电离剂量引起的暗电流的起源。使用0.18 um CMOS图像传感器工艺制造了两种类型的光电二极管和数种厚氧化物FET,并将其暴露在从3 krad到1 Mrad的10 keV X射线下。结果表明,辐射诱导的俘获电荷扩展了氧化物界面处的空间电荷区域,从而导致界面态SRH产生电流的增加。等时退火测试表明,STI界面状态在低于100°C的温度下退火,而在300°C的30分钟后,约有三分之一的捕获电荷保留下来。

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