Laser transmission welding as an assembling process for high temperature electronic packaging.

摘要

Higher efficiency, power density, reliability and longer lifetime of power electronic devices would stem from progresses in material science. In this work, we propose to use a high performance thermoplastic polymer PAEK as packaging box to extend the operating temperature above 200°C. More, the laser transmission welding process has been applied to PAEK to join the two-part module. In order to validate this assembling process, the temperature distribution inside the specimens was measured during laser transmission welding. The assembly consists of a quasi-amorphous sample as the upper part and a semi-crystalline sample as the lower part. The temperature fields were measured by infrared thermography with the camera sensor perpendicular to the welded interface. With an energy beam of 28 J.mm-2 and irradiation time of 15 s, we have noticed that the maximum temperature inside the sample is kept far from the PAEK degradation one. Moreover, the temperature at the interface reaches the melting temperature thus assuring enough mobility for polymeric chains to get adhesion at the interface. The location and size of the heat-affected zone has been determined. Finally, some frames were machined and successfully welded.